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Elevate
Water Based Bonding Adhesive P
QXO product C-265901 · 2 options
Selected: FIR WATER BASE BONDING ADH P 5G
QXO SKU 408682 · Product number FIRWBBA5P
Free, no-obligation quote. Our team confirms local availability, required quantities, compatible components, and installation pricing.
Selected option specifications
- Item Weight
- 48
- Algae Resistance
- No
- Applicable Standards
- FM Approved UL Classified
- Packaging
- 5 gal pail
About this product
Elevate Water Based Bonding Adhesive P is a contact adhesive designed for bonding RubberGard™ EPDM, UltraPly™ TPO, or FormFlash™ membrane products to acceptable substrates. Water Based Bonding Adhesive P is an alternative to Elevate solvent based bonding adhesives.
